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Design capabilities in software innovation settings

  • Felipe Zapata-Roldan

    Research output: Chapter in Book/Conference proceedingConference and proceedingspeer-review

    4 Scopus citations

    Abstract

    The border between tangible and digital products is getting more diffuse, and the design methodologies are converging to a more comprehensive and holistic approach in that sense. The output of these novel innovation processes is often a digital entity like an app or a physical object. For users and consumers, it is important to keep a fluid interface between hardware and software assuring a proper and effective user experience (UX) during all user interaction (UI). This work uses review-centric research to identify from theory, a set of innovation and technological capabilities used in the product design stage of software development, and explores onto which of them are common to the tangible product design. The capabilities were grouped in three dimensions: organizational (human and strategy), structural (technology and knowledge management) and relationships (partnerships and transfer). Agile methodologies, rapid application development (RAD), scrum frameworks, lean development, Unified Modeling Language (UML), and other software industry tools were used as examples of design capability resources alongside new product development (NPD) and its product design and strategy generation tools for project development in tangible/non-tangible products like QFD, Stage-Gate, TRIZ, etc. A model of a common product development cycle for both tangible and software products is displayed showing their similarity and how they connect.

    Original languageEnglish
    Title of host publicationPICMET 2017 - Portland International Conference on Management of Engineering and Technology
    Subtitle of host publicationTechnology Management for the Interconnected World, Proceedings
    EditorsTimothy R. Anderson, Kiyoshi Niwa, Dundar F. Kocaoglu, Tugrul U. Daim, Dilek Cetindamar Kozanoglu, Gary Perman, Harm-Jan Steenhuis
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1-8
    Number of pages8
    ISBN (Electronic)9781890843366
    DOIs
    StatePublished - 29 Nov 2017
    Event2017 Portland International Conference on Management of Engineering and Technology, PICMET 2017 - Portland, United States
    Duration: 9 Jul 201713 Jul 2017

    Publication series

    NamePICMET 2017 - Portland International Conference on Management of Engineering and Technology: Technology Management for the Interconnected World, Proceedings
    Volume2017-January

    Conference

    Conference2017 Portland International Conference on Management of Engineering and Technology, PICMET 2017
    Country/TerritoryUnited States
    CityPortland
    Period9/07/1713/07/17

    Bibliographical note

    Publisher Copyright:
    © 2017 IEEE.

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