TY - JOUR

T1 - Boundary element solution of thermal creep flow in microfluidic devices

AU - Nieto, C.

AU - Power, H.

AU - Giraldo, M.

N1 - Funding Information:
The first author acknowledges the support of the PhD programme at the Universidad Pontificia Bolivariana and COLCIENCIAS, Colombia , under the support provided with the project “Desarrollo de geometrías para aplicación industrial en micro-intercambiadores de calor” code 1210-479-21999, contract 436-2008 .

PY - 2012/7

Y1 - 2012/7

N2 - Flow in rarefied gases can be caused by a tangential temperature gradient along the contour boundaries (tangential heat flux), without the presence of any other external driven force, inducing a fluid motion from colder to hotter regions. This phenomenon is known as thermal creep and has gained importance in recent years in connection with micro-scale gas flow systems. Prediction of the flow field in micro-systems can be obtained by using continuum based models under appropriate boundary conditions accounting for the slip velocity due to tangential shear rate and heat flux. In this work a boundary integral equation formulation for Stokes slip flow, based on the normal and tangential projection of the Greens integral representational formulae for the velocity field is presented. The tangential heat flux is evaluated in terms of the tangential gradient of the temperature integral representational formulae presenting singularities of the Cauchy type, which are removed by the use of an auxiliary potential field. These formulations are used to evaluate the performance of different microfluidic devices.

AB - Flow in rarefied gases can be caused by a tangential temperature gradient along the contour boundaries (tangential heat flux), without the presence of any other external driven force, inducing a fluid motion from colder to hotter regions. This phenomenon is known as thermal creep and has gained importance in recent years in connection with micro-scale gas flow systems. Prediction of the flow field in micro-systems can be obtained by using continuum based models under appropriate boundary conditions accounting for the slip velocity due to tangential shear rate and heat flux. In this work a boundary integral equation formulation for Stokes slip flow, based on the normal and tangential projection of the Greens integral representational formulae for the velocity field is presented. The tangential heat flux is evaluated in terms of the tangential gradient of the temperature integral representational formulae presenting singularities of the Cauchy type, which are removed by the use of an auxiliary potential field. These formulations are used to evaluate the performance of different microfluidic devices.

KW - Boundary element method

KW - Microfluidic devices

KW - Slip boundary conditions

KW - Thermal creep

UR - http://www.scopus.com/inward/record.url?scp=84857437411&partnerID=8YFLogxK

U2 - 10.1016/j.enganabound.2012.01.001

DO - 10.1016/j.enganabound.2012.01.001

M3 - Artículo

AN - SCOPUS:84857437411

VL - 36

SP - 1062

EP - 1073

JO - Engineering Analysis with Boundary Elements

JF - Engineering Analysis with Boundary Elements

SN - 0955-7997

IS - 7

ER -