Design capabilities in software innovation settings

Felipe Zapata-Roldan

    Producción científica: Capítulo del libro/informe/acta de congresoPonencia publicada en las memorias del evento con ISBNrevisión exhaustiva

    4 Citas (Scopus)

    Resumen

    The border between tangible and digital products is getting more diffuse, and the design methodologies are converging to a more comprehensive and holistic approach in that sense. The output of these novel innovation processes is often a digital entity like an app or a physical object. For users and consumers, it is important to keep a fluid interface between hardware and software assuring a proper and effective user experience (UX) during all user interaction (UI). This work uses review-centric research to identify from theory, a set of innovation and technological capabilities used in the product design stage of software development, and explores onto which of them are common to the tangible product design. The capabilities were grouped in three dimensions: organizational (human and strategy), structural (technology and knowledge management) and relationships (partnerships and transfer). Agile methodologies, rapid application development (RAD), scrum frameworks, lean development, Unified Modeling Language (UML), and other software industry tools were used as examples of design capability resources alongside new product development (NPD) and its product design and strategy generation tools for project development in tangible/non-tangible products like QFD, Stage-Gate, TRIZ, etc. A model of a common product development cycle for both tangible and software products is displayed showing their similarity and how they connect.

    Idioma originalInglés
    Título de la publicación alojadaPICMET 2017 - Portland International Conference on Management of Engineering and Technology
    Subtítulo de la publicación alojadaTechnology Management for the Interconnected World, Proceedings
    EditoresTimothy R. Anderson, Kiyoshi Niwa, Dundar F. Kocaoglu, Tugrul U. Daim, Dilek Cetindamar Kozanoglu, Gary Perman, Harm-Jan Steenhuis
    EditorialInstitute of Electrical and Electronics Engineers Inc.
    Páginas1-8
    Número de páginas8
    ISBN (versión digital)9781890843366
    DOI
    EstadoPublicada - 29 nov. 2017
    Evento2017 Portland International Conference on Management of Engineering and Technology, PICMET 2017 - Portland, Estados Unidos
    Duración: 9 jul. 201713 jul. 2017

    Serie de la publicación

    NombrePICMET 2017 - Portland International Conference on Management of Engineering and Technology: Technology Management for the Interconnected World, Proceedings
    Volumen2017-January

    Conferencia

    Conferencia2017 Portland International Conference on Management of Engineering and Technology, PICMET 2017
    País/TerritorioEstados Unidos
    CiudadPortland
    Período9/07/1713/07/17

    Nota bibliográfica

    Publisher Copyright:
    © 2017 IEEE.

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