Distributed Equivalent Circuit for Modeling Heat Transfer Process in a Thermoelectric System

Juan Gabriel Araque-Mora, Luis Angel

    Producción científica: Capítulo del libro/informe/acta de congresoPonencia publicada en las memorias del evento con ISBNrevisión exhaustiva

    2 Citas (Scopus)

    Resumen

    In this paper a heat transfer model based on the theory of electrical and thermal circuits is proposed for steady-state and transient analysis of the thermoelectric system. In the process studied, a Peltier device tries to maintain a larger metal surface at a desired temperature condition. The Peltier cell is implemented with discrete, thermal and electrical components, calculated according to the specifications in the manufacturer's datasheet. Heat transfer by conduction and convection through the metal plate is modelled by a distributed thermal circuit. The distributed element model of the thermal circuit facilitates connection with the Peltier devices and other thermal components situated at different positions on its surface. In this work, the methodology for building the model and examples of simulations shows how the different operating conditions can be modeled intuitively and their thermoelectric parameters measured directly.

    Idioma originalInglés
    Título de la publicación alojadaProceedings of the 2021 IEEE 5th Colombian Conference on Automatic Control, CCAC 2021
    EditoresDiana Marcela Ovalle Martinez, Luis Francisco Combita Alfonso
    EditorialInstitute of Electrical and Electronics Engineers Inc.
    Páginas326-331
    Número de páginas6
    ISBN (versión digital)9781665418836
    DOI
    EstadoPublicada - 2021
    Evento5th IEEE Colombian Conference on Automatic Control, CCAC 2021 - Ibague, Colombia
    Duración: 19 oct. 202122 oct. 2021

    Serie de la publicación

    NombreProceedings of the 2021 IEEE 5th Colombian Conference on Automatic Control, CCAC 2021

    Conferencia

    Conferencia5th IEEE Colombian Conference on Automatic Control, CCAC 2021
    País/TerritorioColombia
    CiudadIbague
    Período19/10/2122/10/21

    Nota bibliográfica

    Publisher Copyright:
    © 2021 IEEE.

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